报告摘要：In the field of power electronics, it is often perceived that for a given product there exists a specific converter topology and design that is deemed best fit. Therefore, new products are developed with garden-variety of topologies and design practices. This practice is deemed as an important factor for competitive advantage. With this mindset, products are highly customized and lack of modularity and more integrated solutions. Most power electronic equipment, with few exceptions, were designed and built based on discrete active and passive components. The power electronics products have reached a point of maturity that any advance of one performance attribute, is often at the expense of others. In addition, the manufacturing practices are labor intensive and remains largely unchanged for decades.
The new generation of wide-band-gap power semiconductor devices, such as SiC and GaN, offer significant reduction of both conduction and switching losses when compared with their silicon counterparts. The current design practice with WBG devices is largely, based on the “plug-in and play” concept, except with an 2-3X increase in switching frequency. The improvements in efficiency and power density are incremental. This practice fails to realize its true potential for a possible paradigm shift in the design and manufacturing process.
Recently, It has been demonstrated that a 10-20X increase in switching frequency can be realized with ZVS to further eliminate the turn- on loss. With that, it is possible to contemplate a fundamental change in design and manufacturing practices with heterogeneous integration on a PCB based platform. Concurrent improvements in all performance attributes can be realized, including efficiency, power density, cost, and EMI. Furthermore, the high labor content of the manufacturing process for magnetics and system assembling process can be removed with automation.
The proposed heterogeneous integration process is not without its limits. This presentation will address the benefits and limitations as well as the applicable power range. |
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报告人简介：Dr. Lee is a University Distinguished Professor Emeritus at Virginia Tech. He is a member of the U.S. National Academy of Engineering, U.S. National Academy of Inventors, and a foreign member of the Chinese Academy of Engineering, China. Dr. Lee founded the Center for power electronics and led a program that encompasses research, technology development, educational outreach, industry collaboration, and technology transfer. To date, more than 230 companies worldwide have benefited from this industry partnership program.
Dr. Lee has supervised to completion 89 Ph.D. and 93 M.S. students. He holds over 100 US patents, and has published over 330 journal articles and more than 760 refereed technical papers. His research interests include high-frequency power conversion, magnetics and EMI, distributed power systems, renewable energy, power quality, high-density electronics packaging and integration, and modeling and control.
Dr. Lee is a recipient of the 2015 IEEE Medal in Power Engineering “for contributions to power electronics, especially high-frequency power conversion."
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